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On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles

On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law

We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.

Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.

The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.

Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.

Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...

Enables more efficient process development via high-fidelity plasma simulation

The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.