Blog

At an industry and investor event held during the August 2019 Flash Memory Summit, Lam management made the case for why semiconductor innovation needs to accelerate in the 5G era and how Lam is...

With the introduction of two new products for 3D NAND manufacturing, Lam expands its stress management product portfolio. The VECTOR DT® PECVD and EOS® GS wet etch systems enable continued 3D...

Food security is a growing concern. With the world’s population forecast to increase from 7.6 billion in 2017 to 9.8 billion by 2050, it’s estimated that an additional billion metric tons of...

The rapid pace of semiconductor evolution places huge demands on the companies making the equipment used to build integrated circuits. With each new silicon node comes a host of new requirements,...

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will take place Sunday, July 21–Wednesday,...

Gain insights, innovations, and intelligence in San Francisco this July 9-11 at the annual SEMICON West tradeshow. Industry leaders from around the world will gather for more than 80 hours of...

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the...

Electrochemistry and solid state science and technology will be featured at the 235th ECS Meeting, to be held May 26–30 in Dallas, Texas. Over the week, nearly two thousand talks will be given...

Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the...

On May 7, 2019, semiconductor leaders and industry experts from around the world will convene at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia to showcase...