Blog

To thank our suppliers for their invaluable support and contributions, Lam recently hosted its Supplier Day with a focus on enhancing collaboration and renewing opportunities for mutual success....

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...