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Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

On Monday, September 9, we announced the development of a systems lab at our India Center for Engineering in Bengaluru. This new facility will be one of the most advanced semiconductor labs in the...

Lam pledged $10 million to FIRST® Global, a nonprofit inspiring future STEM leaders Our university programs help students explore what’s possible in their careers Alexandre Toscano has a...

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.