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Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

Micron awarded Lam for exceptional performance in front-end equipment supply.

Lam Research’s latest milestone in its global expansion is in Tualatin, Oregon. The development signals what’s next for Oregon, the Silicon Forest, and the future of American leadership in the semiconductor industry.

Self-aligned backside contact (SABC) architectures in advanced GAA transistors expand the process window, reducing defects and improving chip yield.

Startup backed by Lam Capital reduces metal contaminated liquid waste by up to 90%

Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.

As a founding donor of the Semiconductor Pathways Fund, Lam Research is taking action to ensure promising STEM students can complete their degrees and power the next generation...

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

As Moore’s Law slows, advanced semiconductor packaging techniques are being adopted to integrate multiple chip types like logic, memory, and I/O into a single package, enhancing performance and cost-efficiency.

Cooperative robots take center stage at FIRST Global in Panama Lam is a pioneer in semi mechatronics, like Dextro

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.

At Lam we're pairing human ingenuity with advanced mechatronics and automation to solve big challenges for our customers. That same spirit will be on display at the 2025 FIRST Global Challenge.

Lam CVP David Fried explains how Fabtex Yield Optimizer is the newest Semiverse Solutions technology to help the semiconductor industry achieve higher yields

an in-depth look at the challenges facing the industry as AI, memory, and logic demands accelerate

The Colorado School of Mines award is given to its most generous contributors Research investigates ways to improve etch selectivity, thermal ALD, and more Share this news with your network

Lam Research earned the 2025 SEMI Award for North America for our pioneering cryogenic etch technology

Fabtex™ Yield Optimizer is a new Semiverse® Solutions product designed to improve yield and reduce process variability in high-volume semiconductor manufacturing.

A critical step toward enabling the next wave of advanced packaging

Virtual twins and process modeling speed up semiconductor development by simulating and optimizing designs before fabrication. This case study shows how to address etch uniformity issues from etch loading in slit patterns, enabling faster, more precise process optimization.

Lam Research offers a range of advanced tools and technologies designed to support semiconductor manufacturing, focusing on precision, innovation, and improving chip production processes. These solutions include etch and deposition systems, process control tools, and software products aimed at next-generation device fabrication.

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Hybrid metallization using Mo is a promising alternative to conventional copper dual damascene.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.

Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Lam continues to demonstrate our commitment to both performance and sustainability

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

SEMulator3D® software is useful for semiconductor process modeling and virtual design Engineers can easily and vividly visualize complicated 3D structures with the tool Semiverse® Solutions,...

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

First graduating class completes immersive, hands-on microscopy training

Driving the news: For the tenth consecutive year, Lam Research is recognized on the Fortune 500, ranking at #295. Lam first debuted on the Fortune 500 at #491 in 2016 and has grown revenue 183%...

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

Discover how Lam Research's ALTUS® Halo tool is transforming semiconductor manufacturing with molybdenum.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The semiconductor industry is transitioning from tungsten to molybdenum (Mo) to meet the demands of the AI era Mo’s lower resistivity and lack of barrier layer enable scalability while...

For the second year in a row Texas Instruments (TI) has awarded Lam Research its highest level of supplier recognition

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

For Lam Research, Oregon isn’t just a place to work–it’s home. For over three decades, we’ve been proud to put down roots in the Silicon Forest. How it started: It all began with a secret....

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

Driving the news: Lam recently celebrated two significant milestones at our Enschede, Netherlands, location: the grand opening of a newly remodeled facility and the third anniversary of a...

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).