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Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

Micron awarded Lam for exceptional performance in front-end equipment supply.

Lam Research’s latest milestone in its global expansion is in Tualatin, Oregon. The development signals what’s next for Oregon, the Silicon Forest, and the future of American leadership in the semiconductor industry.

Self-aligned backside contact (SABC) architectures in advanced GAA transistors expand the process window, reducing defects and improving chip yield.

Startup backed by Lam Capital reduces metal contaminated liquid waste by up to 90%

Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.

As a founding donor of the Semiconductor Pathways Fund, Lam Research is taking action to ensure promising STEM students can complete their degrees and power the next generation...

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

As Moore’s Law slows, advanced semiconductor packaging techniques are being adopted to integrate multiple chip types like logic, memory, and I/O into a single package, enhancing performance and cost-efficiency.

Cooperative robots take center stage at FIRST Global in Panama Lam is a pioneer in semi mechatronics, like Dextro

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.

At Lam we're pairing human ingenuity with advanced mechatronics and automation to solve big challenges for our customers. That same spirit will be on display at the 2025 FIRST Global Challenge.

Lam CVP David Fried explains how Fabtex Yield Optimizer is the newest Semiverse Solutions technology to help the semiconductor industry achieve higher yields

an in-depth look at the challenges facing the industry as AI, memory, and logic demands accelerate

The Colorado School of Mines award is given to its most generous contributors Research investigates ways to improve etch selectivity, thermal ALD, and more Share this news with your network

Lam Research earned the 2025 SEMI Award for North America for our pioneering cryogenic etch technology

Fabtex™ Yield Optimizer is a new Semiverse® Solutions product designed to improve yield and reduce process variability in high-volume semiconductor manufacturing.

A critical step toward enabling the next wave of advanced packaging

Virtual twins and process modeling speed up semiconductor development by simulating and optimizing designs before fabrication. This case study shows how to address etch uniformity issues from etch loading in slit patterns, enabling faster, more precise process optimization.

Lam Research offers a range of advanced tools and technologies designed to support semiconductor manufacturing, focusing on precision, innovation, and improving chip production processes. These solutions include etch and deposition systems, process control tools, and software products aimed at next-generation device fabrication.

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Hybrid metallization using Mo is a promising alternative to conventional copper dual damascene.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.

Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Lam continues to demonstrate our commitment to both performance and sustainability

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

SEMulator3D® software is useful for semiconductor process modeling and virtual design Engineers can easily and vividly visualize complicated 3D structures with the tool Semiverse® Solutions,...

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

First graduating class completes immersive, hands-on microscopy training

Driving the news: For the tenth consecutive year, Lam Research is recognized on the Fortune 500, ranking at #295. Lam first debuted on the Fortune 500 at #491 in 2016 and has grown revenue 183%...

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

Discover how Lam Research's ALTUS® Halo tool is transforming semiconductor manufacturing with molybdenum.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The semiconductor industry is transitioning from tungsten to molybdenum (Mo) to meet the demands of the AI era Mo’s lower resistivity and lack of barrier layer enable scalability while...

For the second year in a row Texas Instruments (TI) has awarded Lam Research its highest level of supplier recognition

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

For Lam Research, Oregon isn’t just a place to work–it’s home. For over three decades, we’ve been proud to put down roots in the Silicon Forest. How it started: It all began with a secret....

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

Driving the news: Lam recently celebrated two significant milestones at our Enschede, Netherlands, location: the grand opening of a newly remodeled facility and the third anniversary of a...

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

Lam Research has been recognized by Fortune as one of the World’s Most Admired Companies for the eighth consecutive year. Why it matters: The annual survey recognizes the world’s largest...

Each year, our employees come together through our Deliver Joy campaign to make a difference in the communities we call home. In 2024, we set new records - 2,506 employee participants, 16,451...

Lam's team conducted critical simulations and experiments that refined the plasma etching process.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Driving the news: Lam Research secures a spot on the 2024 Dow Jones Sustainability Index (DJSI) North America1 for the fourth year in a row, maintaining our position as a corporate sustainability...

Lam Research's new cobot, Dextro, can offload some of the most challenging and essential maintenance and cleaning tasks from human workers.

As a company deeply committed to fostering an inclusive and supportive workplace for all, I’m proud to share that we have earned a perfect score of 100 on the Human Rights Campaign’s (HRC)...

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.

Dextro, the industry’s first maintenance cobot, works alongside engineers to keep machines in good working order for improved overall yields.

The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.

Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.

VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.

Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.

AR and VR are helping the company shift left and ramp for the $1 trillion industry Lam’s adoption of immersive technologies is expected to beat today’s KPIs by 20% Driving the news: With the...

On Tuesday, October 8, Tim Archer, president and CEO of Lam Research, and Joon Park, regional vice president of Lam Research Korea, celebrated the grand opening of Lam’s new Yongin Campus in...

Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...

In 2023, Lam Research began a three-year, $10 million investment in FIRST® Global, an organization that inspires leadership and innovation in youth worldwide by empowering them through STEM. Take...

Lam honors nine suppliers with 2024 Excellence Awards The awards highlight Lam’s commitment to building a responsible and ethical supply chain Driving the news: Today, we announced this year’s...

By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

On Monday, September 9, we announced the development of a systems lab at our India Center for Engineering in Bengaluru. This new facility will be one of the most advanced semiconductor labs in the...

Lam pledged $10 million to FIRST® Global, a nonprofit inspiring future STEM leaders Our university programs help students explore what’s possible in their careers Alexandre Toscano has a...

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.

“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.

Driving the news: Today, Lam Research received the Coat of Arms from Günther Albel, the Mayor of Villach, Austria, in recognition of our over 30-year presence in the city and our contributions to...

Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.

Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

Lam Research published our latest Environmental, Social, and Governance report The report focuses on energy savings across our operations, products, and supply chain This story is part of our 2023...

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

Explore key factors that drive grand discoveries at Lam, as revealed by a top innovator Samantha Tan's visionary approach balances high-risk research with profitable outcomes Samantha Tan, Lam...

Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.

Prestis enables the deposition of high-quality, highly scandium-doped AlScN films

Etching is critical for creating complex structures and architectures for the AI era

Lam is a founding sponsor of Semiconductor PRIDE, a group dedicated to advancing LGBTQ+ equity By joining, Lam reaffirms our long-standing commitment to inclusion and diversity This Pride Month, we’

The event is the only startup competition with a monetary award for semiconductor startups

Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.

This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.

Lam Research went public on the Nasdaq under the ticker symbol LRCX in 1984.