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By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

On Monday, September 9, we announced the development of a systems lab at our India Center for Engineering in Bengaluru. This new facility will be one of the most advanced semiconductor labs in the...

Lam pledged $10 million to FIRST® Global, a nonprofit inspiring future STEM leaders Our university programs help students explore what’s possible in their careers Alexandre Toscano has a...

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.

“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.

Driving the news: Today, Lam Research received the Coat of Arms from Günther Albel, the Mayor of Villach, Austria, in recognition of our over 30-year presence in the city and our contributions to...

Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.

Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

Lam Research published our latest Environmental, Social, and Governance report The report focuses on energy savings across our operations, products, and supply chain This story is part of our 2023...

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

Explore key factors that drive grand discoveries at Lam, as revealed by a top innovator Samantha Tan's visionary approach balances high-risk research with profitable outcomes Samantha Tan, Lam...

Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.

Pulsus enables the deposition of high-quality, highly scandium-doped AlScN films

Etching is critical for creating complex structures and architectures for the AI era

Lam is a founding sponsor of Semiconductor PRIDE, a group dedicated to advancing LGBTQ+ equity By joining, Lam reaffirms our long-standing commitment to inclusion and diversity This Pride Month, we’

The event is the only startup competition with a monetary award for semiconductor startups