Blog

This month, copper interconnects turned 20. That’s probably something like 200 in “technology years” considering the pace of innovation today. Yet even after 20 years of advances in...

As consumers, we see evidence of the Internet of Things (IoT) all around us. A growing number of everyday objects in our homes and cars are now digitally connected in a way that allows us to...

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits of what is possible. One...

Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are...

State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in Nashville, Tennessee. This...

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world,...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 nm, reducing power...

Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating...

The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices...