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The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.

Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.

VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.

Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.