Blog

Lam’s Semiverse Solutions team used digital twin modeling to explore a self-aligned CFET architecture that could help extend CMOS scaling beyond 10 Å.

Lam Research’s new Silicon Valley warehouse speeds semiconductor parts retrieval and strengthens U.S. supply chain resilience.

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...

Lam Research broke ground on a new advanced R&D lab in Tualatin, Oregon, expanding cleanroom capacity and strengthening its global lab network.