Blog

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric etch. At the 10 nm...

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors from around the...

To thank our suppliers for their invaluable support and contributions, Lam recently hosted its Supplier Day with a focus on enhancing collaboration and renewing opportunities for mutual success....

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...