Blog

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...

The semiconductor industry uses so many unique terms, it practically has its own language. To keep up on the latest developments, knowing that “language” can be really helpful. For instance,...

What do the military and the semiconductor industry have in common? More than you might think! In terms of the type of work, they are “worlds away,” and yet many of the skills developed during...

What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 nm, reducing power...

Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating...

Beijing, China — The award ceremony for the 2015 Lam Research Tsinghua University thesis awards was recently held at Tsinghua University in China. Martin Anstice, president and CEO of Lam...

We are proud to share that for the first time Lam Research has been named to the prestigious FORTUNE 500® list of the largest U.S. companies. This annual list, which is compiled by FORTUNE...