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Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Lam continues to demonstrate our commitment to both performance and sustainability

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

SEMulator3D® software is useful for semiconductor process modeling and virtual design Engineers can easily and vividly visualize complicated 3D structures with the tool Semiverse® Solutions,...