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|Dec 18, 2025|Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.
|Dec 9, 2025|Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.
|Dec 8, 2025|Micron awarded Lam for exceptional performance in front-end equipment supply.
|Nov 21, 2025|Lam Research’s latest milestone in its global expansion is in Tualatin, Oregon. The development signals what’s next for Oregon, the Silicon Forest, and the future of American leadership in the semiconductor industry.