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DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.

Lam’s newest innovation, the VECTOR® TEOS 3D tool, is crafted at its Tualatin, Oregon facility by a talented local workforce known for its multidisciplinary expertise. The company’s strong commitment to employee safety, career satisfaction, and professional growth has resulted in an outstanding retention rate, making Tualatin a standout example of manufacturing excellence.

Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.

Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

Self-aligned backside contact (SABC) architectures in advanced GAA transistors expand the process window, reducing defects and improving chip yield.

Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

Cooperative robots take center stage at FIRST Global in Panama Lam is a pioneer in semi mechatronics, like Dextro

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.

At Lam we're pairing human ingenuity with advanced mechatronics and automation to solve big challenges for our customers. That same spirit will be on display at the 2025 FIRST Global Challenge.

Lam CVP David Fried explains how Fabtex Yield Optimizer is the newest Semiverse Solutions technology to help the semiconductor industry achieve higher yields

an in-depth look at the challenges facing the industry as AI, memory, and logic demands accelerate

The Colorado School of Mines award is given to its most generous contributors Research investigates ways to improve etch selectivity, thermal ALD, and more Share this news with your network

Lam Research earned the 2025 SEMI Award for North America for our pioneering cryogenic etch technology

Fabtex™ Yield Optimizer is a new Semiverse® Solutions product designed to improve yield and reduce process variability in high-volume semiconductor manufacturing.

A critical step toward enabling the next wave of advanced packaging

Virtual twins and process modeling speed up semiconductor development by simulating and optimizing designs before fabrication. This case study shows how to address etch uniformity issues from etch loading in slit patterns, enabling faster, more precise process optimization.

Lam Research offers a range of advanced tools and technologies designed to support semiconductor manufacturing, focusing on precision, innovation, and improving chip production processes. These solutions include etch and deposition systems, process control tools, and software products aimed at next-generation device fabrication.

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Hybrid metallization using Mo is a promising alternative to conventional copper dual damascene.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.