Blog

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Hybrid metallization using Mo is a promising alternative to conventional copper dual damascene.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.

Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The semiconductor industry is transitioning from tungsten to molybdenum (Mo) to meet the demands of the AI era Mo’s lower resistivity and lack of barrier layer enable scalability while...

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Lam Research's new cobot, Dextro, can offload some of the most challenging and essential maintenance and cleaning tasks from human workers.

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.