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- |Apr 13, 2023|
Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...
- |Apr 12, 2023|
The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.
- |Apr 5, 2023|
Hong Shih is one of 10 employees within the company who has been elevated to Lam Fellow He has more than 40 years of experience in sciences and engineering with over 30 years working in the...
- |Mar 22, 2023|
Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...
- |Mar 17, 2023|
System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.
- |Mar 7, 2023|
Women in Leadership at Lam has over 200 members Lam India has increased its diversity hiring percentages In recognition of International Women’s Day, Tina Correia, chief accounting officer, head...
- |Mar 7, 2023|
Gosia’s redirection in her studies resulted in a 20+ year long career in semiconductors A little bit of luck and a whole lot of talent got her to where she is today I sat down with Gosia...
- |Mar 3, 2023|
Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...
- |Feb 28, 2023|
With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...