Blog

Happy holidays from all of us at Lam. Wishing you a safe, successful, and happy new year. We appreciate your readership and look forward to connecting with you again when our blog returns in...

Committing to human rights is not only the right thing to do, it’s also a business imperative. Customers are demanding that our products are made free of exploitative work practices, and Lam is...

At Lam, we aspire to build a culture where every employee – at every level and function – can contribute to an environment where people of diverse backgrounds feel valued, included, and...

Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of dielectric atomic layer deposition...

The 22nd Electronics Packaging Technology Conference (EPTC) is going virtual this year. The flagship event of the IEEE Electronics Packaging Society (EPS) in Region 10 will highlight technical...

The movement of money has undergone substantial changes over the years. With the advent of financial technology, or FinTech, the financial services industry has transformed. Enabled by today’s...

As a leading technology company, we believe that advancing students’ achievements in STEM education now will contribute to the economic development of our communities and the success of our...

On National STEM/STEAM Day, Lam marks its commitment to programs that inspire young people’s passion for math and science education. In early October, we joined thousands of manufacturers across...

This year has been unlike any other, forcing many of our suppliers to navigate new challenges in an already challenging landscape. Together, with our suppliers, we have played a critical role in...

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As compared to...