Blog

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world,...

We take corporate social responsibility (CSR) concerns like caring for the environment and our communities seriously here at Lam. Our commitment to social responsibility and sustainability plays...

Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check our mobile phones, use our computers, start our...

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric etch. At the 10 nm...

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors from around the...

To thank our suppliers for their invaluable support and contributions, Lam recently hosted its Supplier Day with a focus on enhancing collaboration and renewing opportunities for mutual success....

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...