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Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

SEMulator3D® software is useful for semiconductor process modeling and virtual design Engineers can easily and vividly visualize complicated 3D structures with the tool Semiverse® Solutions,...

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

First graduating class completes immersive, hands-on microscopy training

Driving the news: For the tenth consecutive year, Lam Research is recognized on the Fortune 500, ranking at #295. Lam first debuted on the Fortune 500 at #491 in 2016 and has grown revenue 183%...

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

Discover how Lam Research's ALTUS® Halo tool is transforming semiconductor manufacturing with molybdenum.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).