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- |Sep 20, 2022|
Alyson’s “accidental career path” went from family therapy fantasies to running IT ops Getting rid of impostor syndrome is one piece of advice she gives to young women “I run the internal...
- |Sep 14, 2022|
The India Center for Engineering (ICE) is Lam’s fifth R&D lab worldwide ICE enables the success of our customers globally by improving speed to solution Today, Lam Research held the grand...
- |Sep 8, 2022|
Calling all innovative entrepreneurs working on sustainability solutions The winner will be offered a $250,000 SAFE investment Theme is “Engineering a Greener Fab” Heatwaves such as the one...
- |Aug 30, 2022|
John has 25 years in the industry and 49 patents to his name Multidisciplinary skills in dep and etch have led to groundbreaking work John Drewery has been named a Lam Research Fellow for...
- |Aug 25, 2022|
Connect with us through our new Social Impact Program! What does it mean to have a “social impact”? For us at Lam Research, it means building meaningful partnerships with organizations that...
- |Aug 18, 2022|
Introduction BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line-to-line...
- |Aug 17, 2022|
At Lam, we operate at the atomic scale—etching and depositing materials onto silicon wafers more than 10,000 times smaller than the size of objects that can be seen with the naked eye....
- |Aug 9, 2022|
Lam has five manufacturing sites in California, Ohio, and Oregon Today, nearly every chip in the world is built using Lam technology President Biden signed the bipartisan CHIPS and Science Act...
- |Jul 21, 2022|
The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...
- |Jul 15, 2022|
Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are...