| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
-
|Jul 23, 2024|Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.
-
|Jul 16, 2024|On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.
-
|Jun 24, 2024|Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.
-
|Jun 20, 2024|Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.
-
|Jun 18, 2024|Prestis enables the deposition of high-quality, highly scandium-doped AlScN films
-
|Jun 12, 2024|Etching is critical for creating complex structures and architectures for the AI era
-
|Jun 7, 2024|The event is the only startup competition with a monetary award for semiconductor startups
-
|Jun 6, 2024|Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.
-
|May 28, 2024|This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.
-
|May 20, 2024|The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.
-
|Apr 23, 2024|Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.
-
|Apr 16, 2024|Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...
-
|Apr 12, 2024|Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...
-
|Mar 26, 2024|Introducing Prestis, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.
-
|Mar 21, 2024|There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.
-
|Mar 19, 2024|Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...
-
|Mar 11, 2024|One-of-a-kind contest supports semiconductor startups with investment and exposure
-
|Feb 22, 2024|On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles
-
|Feb 1, 2024|On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law
-
|Jan 23, 2024|We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.
-
|Jan 18, 2024|Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.
-
|Dec 12, 2023|The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.
-
|Nov 20, 2023|Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.
-
|Nov 8, 2023|Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...
-
|Oct 25, 2023|Enables more efficient process development via high-fidelity plasma simulation
