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Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost of back-end processes for some...

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking business. Attendees...

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits of what is possible. One...

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, 2017. Korea is the world’s...

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure...

This year marks the 40th anniversary for SEMICON Japan, one of the most extensive international exhibitions of semiconductor equipment and materials. Each SEMI tradeshow has its own unique...

Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are...

Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day there would be devices so...

State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in Nashville, Tennessee. This...

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world,...

Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check our mobile phones, use our computers, start our...

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric etch. At the 10 nm...

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors from around the...

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process with its...

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of...

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more powerful...

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, however,...

The semiconductor industry uses so many unique terms, it practically has its own language. To keep up on the latest developments, knowing that “language” can be really helpful. For instance,...

What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 nm, reducing power...

Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to increase, fabricating...

Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will...

The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices...

Building on its inaugural success last year, this year’s SEMICON Southeast Asia 2016 takes place April 26-28 at the SPICE Arena in Penang, Malaysia. Lam is pleased to be a premier sponsor of...

Since its introduction in the 1980s, NAND flash memory has radically changed how we store our digital data. Remember ordering duplicate photos when getting camera film developed or burning your...

The global semiconductor industry will be heading to the Shanghai New International Expo Centre for this year’s SEMICON China, which takes place March 15-17. Held in one of the largest and most...