Blog

AI is compressing chip development timelines and raising the stakes for equipment suppliers Here is how Lam is responding Speed has always mattered in the semiconductor industry. What is different...

Integrity isn’t optional at Lam, and this latest recognition underscores that commitment.

IBM and Lam Research have partnered in a five-year collaboration to develop processes that enable logic chip scaling beyond the 1nm node using high-NA EUV lithography.

The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.

Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.

SEMulator3D® Analytics is useful in calibrating FinFET device profiles, helping engineers achieve high precision in modeling fin etch depth and critical dimensions.

With AI's overwhelming demand for DRAM, Lam is accelerating its response with streamlined workflows and specialized tools help speed efficiency, yield, and cost savings.

As a viable alternative to silicon, gallium nitride (GaN) can help data centers meet the growing demands of AI by enabling more efficient power delivery and reducing energy consumption.

Boise investment keeps Lam’s capabilities tightly coupled to customer roadmaps

DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.