Blog

Lam Research went public on the Nasdaq under the ticker symbol LRCX in 1984.

The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.

As semiconductor complexity increases with scaling, specialized expertise in areas like plasma physics and artificial intelligence (AI) becomes crucial. Lam faces challenges in workforce...

Lam’s newest warehouse is the most automated within the company, enabling seamless movement of materials It’s co-located with a Lam manufacturing site, reducing transportation time, cost, and...

Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.

A key component of Lam’s strategy is improving the energy efficiency of our products

Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...

Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...

Introducing Pulsus, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.