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Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The semiconductor industry is transitioning from tungsten to molybdenum (Mo) to meet the demands of the AI era Mo’s lower resistivity and lack of barrier layer enable scalability while...

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Lam Research's new cobot, Dextro, can offload some of the most challenging and essential maintenance and cleaning tasks from human workers.

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.

Dextro, the industry’s first maintenance cobot, works alongside engineers to keep machines in good working order for improved overall yields.

The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.

Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.

VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.

Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.

Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...

By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.

“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.

Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.

Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.

Prestis enables the deposition of high-quality, highly scandium-doped AlScN films

Etching is critical for creating complex structures and architectures for the AI era

The event is the only startup competition with a monetary award for semiconductor startups

Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.

This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.

The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.

Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.

Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...

Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...

Introducing Prestis, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.