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Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform

New portfolio joins physical and virtual semiconductor worlds into a single ecosystem

Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions

As transistor sizes shrink, short channel effects make it more difficult for transistor gates to turn a transistor ON and OFF [1]. One method to overcome this problem is to move away from planar...

As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have...

Achievement represents close collaboration with our customers and supply chain partners LMK joins Lam’s manufacturing operations in Livermore, Tualatin, and Taiwan in this milestone This week,...

EVs can have almost twice as many microchips as combustion engine vehicles. Lam is a critical supplier for semiconductor manufacturers for EVs across all technologies.

Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...

The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.

Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...

System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.

Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...

With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...

SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...

Metryx marked 200th tool shipment by donating science equipment to a local high school

Line edge roughness (LER) can occur during the exposure step in lithography [1-2]. Similarly, etch and deposition process steps can leave a roughness on semiconductor surfaces. LER is a stochastic...

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade...

“Engineering a Greener Fab” was the theme of the Lam Research Technical Symposium, Lam’s premiere forum for intellectual and scientific sharing.

Introduction The semiconductor industry has been focused on scaling and developing advanced technologies using advanced etch tools and techniques. With decreasing semiconductor device dimensions...

Lam Research was the platinum sponsor of the 27th gathering of SEMICON Taiwan, held September 14 to 16. More than 45,000 attendees examined 2,450 exhibition booths showing the latest industry...

Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce...

With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of...

John has 25 years in the industry and 49 patents to his name Multidisciplinary skills in dep and etch have led to groundbreaking work John Drewery has been named a Lam Research Fellow for...

Introduction BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line-to-line...

The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are...

And yes, we’ve got a solution for that In the recent blog article Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected, David Haynes from our Customer...

Lam Research will join fellow industry leaders from the extended electronics supply chain in a range of talks at the SEMICON West 2022 hybrid conference later this month. During the 52nd annual...

Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more...

It takes a lot of different types of process tools to make chips, from deposition, to lithographic to etch and to cleaning tools among others. Large scale production requires chipmakers to use...

Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for...

Design of Experiments (DOE) is a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and...

Over the past decade, the need for increasingly smaller, denser, more powerful chips has been driving semiconductor manufacturers to move away from planar structures in favor of increasingly...

Today, I am proud and excited to officially announce the availability of three new precision selective etch innovations from Lam Research: Argos®, Prevos™, and Selis®. Designed to complement...

When I was a small child, I remember watching a 1966 American sci-fi adventure movie called “Fantastic Voyage” (the Korean title was “Micro Squad”) on an old black-and-white TV. The...

The logic and memory chips that power our smart phones, laptops, gaming consoles and other favorite devices may be stealing all the headlines these days, but there are other types of...

For decades, the semiconductor industry has been defined by our ability to innovate. Each time we’ve been faced with seemingly insurmountable technological challenges, we have invented...

The ability to process data is foundational to our smart, connected world. Microprocessors, in turn, rely on memory chips to store the data they need while working. One of the most popular types...

Lam recently achieved an impressive product milestone with the shipment of our 10,000th single wafer clean chamber. This marks an incredible journey from the SP100 single chamber product first...

We play a critical role in driving semiconductor breakthroughs for the next generation. Since 2015, Unlock Ideas has been an integral program to unleash the power of innovation by providing gifts...

From August 23-27, our experts will join industry leaders at SEMICON Southeast Asia, to discuss semiconductor advancements in an era of 5G and next-generation technologies. Themed “Powering...

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone age, bronze age and iron age were all essential...

There’s a lot of talk about the Internet of Things (IoT) and its impact on our day-to-day lives. From home security systems to smart watches, IoT is upgrading the technologies we rely on every...

Helium gas is increasingly in short supply. While consumers may be most familiar with it for use in filling balloons, it is used much more heavily in a variety of industrial processes –...

Back in 1981, Lam pioneered single-wafer plasma etch tools with its first product, the Lam AutoEtch 480 plasma etcher. Introduced as “a streamlined plasma etching system designed specifically...

The IEEE International Interconnect Technology Conference (IITC) will be held July 6-9, 2021, as a hybrid event – virtual and in-person (Kyoto Research Park, Kyoto, Japan), with on-demand...

Preventative Maintenance “What is wet, but dry?” might sound like a riddle, and the answer for plasma process tools are “wet cleans,” an important type of preventative maintenance. The...

Chip features continue to shrink to incredibly small dimensions and different device architectures are being devised to supply consumers with more powerful electronics. Atomic layer deposition...

The pervasive use of technology has brought about a tremendous growth in data as well as an explosion in scaling and complexity of integrated circuits. That trend continues as the focus on...

We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows up in their lives. It’s not just their...