Blog

Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June 3....

Silicon chip manufacturing has always included etching as a critical processing step. But, increasingly, extremely high-aspect-ratio etching has been needed for 3D flash and DRAM chips, which have...

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer;...

Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards,...

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps that transfers chip...

With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground up specifically for...

To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain. Held February 3-12, participants can learn more about artificial...

To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that help put technology concepts into perspective...

Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of dielectric atomic layer deposition...

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. As compared to...

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete,...

Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer processing. The GAMMA GxT has been specifically...

In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio (HAR)...

Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall 1...

Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information versus looking at numbers and statistics,...

SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights on...

Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of the pioneering work Lam Research has done over...

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes,...

A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be a sponsor of this event, which encompassed the...

The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June 29–Wednesday, July...

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes in manufacturing being...

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and...

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor...

Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s Equipment Intelligence®...

Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity...

The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February 23-27, 2020, the event features...

[Notice] SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will not take place as planned. You can find the details at the...

2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to Work Day, to showcasing our innovative technology and productivity...

The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via upgrades to 200 mm equipment is a cost appropriate...

Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems. Chipmakers have long sought to overcome...

It is an exciting time to be in the semiconductor industry and driving technology development which is fueling the intelligent, interconnected systems that will transform the way we work and live....

Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. Yang Pan, corporate vice president of advanced technology development, shares...

The SEMICON Europa tradeshow, the annual premier event for the global electronics industry in Europe, will take place November 12-15, 2019, at Messe München in Munich, Germany. The event connects...

Moore’s Law has been the center of the semiconductor universe, dominated by a singular focus and a relentless drive to reduce transistor size and integrate more, smaller, faster transistors on...

Technology experts and business leaders will be heading to the Advanced Semiconductor Technology Conference (ASTC) 2019, organized by SEMI Southeast Asia. Held November 7-8, 2019 at the Marina Bay...

The science and technology of materials, interfaces, and processing will be in the spotlight at the AVS 66th International Symposium and Exhibition, being held October 20-25 in Columbus, Ohio....

The 21st Semiconductor Exhibition (SEDEX) will be held this year at COEX in Seoul, Korea, October 8-11. The tradeshow will cover the full spectrum of the semiconductor industry supply chain; it...

The fall meeting of the Electrochemical Society will be held October 13-17 in Atlanta, Georgia. A forum for the latest scientific and technical developments in both electrochemistry and solid...

The largest microelectronics event in Taiwan is coming to TaiNEX this fall, welcoming more than 45,000 visitors from around the world. From September 18-20, leaders from the semiconductor industry...

At an industry and investor event held during the August 2019 Flash Memory Summit, Lam management made the case for why semiconductor innovation needs to accelerate in the 5G era and how Lam is...

With the introduction of two new products for 3D NAND manufacturing, Lam expands its stress management product portfolio. The VECTOR DT® PECVD and EOS® GS wet etch systems enable continued 3D...

Food security is a growing concern. With the world’s population forecast to increase from 7.6 billion in 2017 to 9.8 billion by 2050, it’s estimated that an additional billion metric tons of...

The rapid pace of semiconductor evolution places huge demands on the companies making the equipment used to build integrated circuits. With each new silicon node comes a host of new requirements,...

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will take place Sunday, July 21–Wednesday,...

Gain insights, innovations, and intelligence in San Francisco this July 9-11 at the annual SEMICON West tradeshow. Industry leaders from around the world will gather for more than 80 hours of...

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the...

Electrochemistry and solid state science and technology will be featured at the 235th ECS Meeting, to be held May 26–30 in Dallas, Texas. Over the week, nearly two thousand talks will be given...

Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the...

On May 7, 2019, semiconductor leaders and industry experts from around the world will convene at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia to showcase...

Addressing a need for self-maintaining semiconductor equipment, Lam has developed an etch productivity solution that extends the mean time between cleans (MTBC), a major limiter of etch system...