Blog

The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.

Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.

VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.

Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.

Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...

By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.

“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.

Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.

Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.

Pulsus enables the deposition of high-quality, highly scandium-doped AlScN films

Etching is critical for creating complex structures and architectures for the AI era

The event is the only startup competition with a monetary award for semiconductor startups

Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.

This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.

The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.

Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.

Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...

Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...

Introducing Pulsus, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.

Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...

One-of-a-kind contest supports semiconductor startups with investment and exposure

On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles

On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law

We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.

Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.

The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.

Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.

Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...

Enables more efficient process development via high-fidelity plasma simulation

The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.

Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control

Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.

Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.

BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.

Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.

DRAM is following NAND in going 3D, but architecture needs are unique and challenging. 3D DRAM is needed to keep up with the demands of graphics cards, portable devices, and more. Here's an idea of how to architect it.

Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform