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- |Apr 16, 2024|
Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...
- |Apr 12, 2024|
Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...
- |Mar 26, 2024|
Introducing Pulsus, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.
- |Mar 21, 2024|
There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.
- |Mar 19, 2024|
Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...
- |Mar 11, 2024|
One-of-a-kind contest supports semiconductor startups with investment and exposure
- |Feb 22, 2024|
On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles
- |Feb 1, 2024|
On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law
- |Jan 23, 2024|
We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.
- |Jan 18, 2024|
Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.
- |Dec 12, 2023|
The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.
- |Nov 20, 2023|
Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.
- |Nov 8, 2023|
Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...
- |Oct 25, 2023|
Enables more efficient process development via high-fidelity plasma simulation
- |Oct 19, 2023|
The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.
- |Sep 26, 2023|
Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control
- |Sep 14, 2023|
Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.
- |Aug 31, 2023|
Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.
- |Aug 23, 2023|
BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.
- |Aug 9, 2023|
Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.
- |Jul 14, 2023|
DRAM is following NAND in going 3D, but architecture needs are unique and challenging. 3D DRAM is needed to keep up with the demands of graphics cards, portable devices, and more. Here's an idea of how to architect it.
- |Jun 22, 2023|
Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform
- |Jun 22, 2023|
New portfolio joins physical and virtual semiconductor worlds into a single ecosystem
- |Jun 20, 2023|
Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions
- |Jun 14, 2023|
As transistor sizes shrink, short channel effects make it more difficult for transistor gates to turn a transistor ON and OFF [1]. One method to overcome this problem is to move away from planar...
- |May 30, 2023|
As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have...
- |May 25, 2023|
Achievement represents close collaboration with our customers and supply chain partners LMK joins Lam’s manufacturing operations in Livermore, Tualatin, and Taiwan in this milestone This week,...
- |May 2, 2023|
EVs can have almost twice as many microchips as combustion engine vehicles. Lam is a critical supplier for semiconductor manufacturers for EVs across all technologies.
- |Apr 13, 2023|
Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...
- |Apr 12, 2023|
The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.
- |Mar 22, 2023|
Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...
- |Mar 17, 2023|
System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.
- |Mar 3, 2023|
Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...
- |Feb 28, 2023|
With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...
- |Feb 16, 2023|
SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...
- |Feb 2, 2023|
Metryx marked 200th tool shipment by donating science equipment to a local high school
- |Jan 13, 2023|
Line edge roughness (LER) can occur during the exposure step in lithography [1-2]. Similarly, etch and deposition process steps can leave a roughness on semiconductor surfaces. LER is a stochastic...
- |Dec 19, 2022|
At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade...
- |Nov 21, 2022|
“Engineering a Greener Fab” was the theme of the Lam Research Technical Symposium, Lam’s premiere forum for intellectual and scientific sharing.
- |Nov 8, 2022|
Introduction The semiconductor industry has been focused on scaling and developing advanced technologies using advanced etch tools and techniques. With decreasing semiconductor device dimensions...
- Lam Research Drives Technology Advancements for Next-Generation Semiconductors (SEMICON Taiwan 2022)|Nov 2, 2022|
Lam Research was the platinum sponsor of the 27th gathering of SEMICON Taiwan, held September 14 to 16. More than 45,000 attendees examined 2,450 exhibition booths showing the latest industry...
- |Oct 27, 2022|
Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce...
- |Sep 22, 2022|
With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of...
- |Aug 30, 2022|
John has 25 years in the industry and 49 patents to his name Multidisciplinary skills in dep and etch have led to groundbreaking work John Drewery has been named a Lam Research Fellow for...
- |Aug 18, 2022|
Introduction BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line-to-line...
- |Jul 21, 2022|
The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...
- |Jul 15, 2022|
Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are...
- |Jul 12, 2022|
And yes, we’ve got a solution for that In the recent blog article Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected, David Haynes from our Customer...
- |Jul 7, 2022|
Lam Research will join fellow industry leaders from the extended electronics supply chain in a range of talks at the SEMICON West 2022 hybrid conference later this month. During the 52nd annual...
- |Jun 16, 2022|
Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more...