Blog

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Hybrid metallization using Mo is a promising alternative to conventional copper dual damascene.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.

Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Lam continues to demonstrate our commitment to both performance and sustainability

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

SEMulator3D® software is useful for semiconductor process modeling and virtual design Engineers can easily and vividly visualize complicated 3D structures with the tool Semiverse® Solutions,...

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Dextro™ revolutionizes fab maintenance with sub-micron precision and AI-driven capabilities

First graduating class completes immersive, hands-on microscopy training

Driving the news: For the tenth consecutive year, Lam Research is recognized on the Fortune 500, ranking at #295. Lam first debuted on the Fortune 500 at #491 in 2016 and has grown revenue 183%...

Tiny changes in critical dimension, gate height, and similar features of advanced logic devices, such as FinFET SRAM, can affect yield. Through virtual experiments using the SEMulator3D® platform, the Semiverse Solutions team discusses how material stress and mechanical deformation resulting from these changes can be managed to enhance device performance.

Discover how Lam Research's ALTUS® Halo tool is transforming semiconductor manufacturing with molybdenum.

AI’s evolution could be thwarted by electrical resistance in 3D architectures. Molybdenum, a breakthrough material, reduces resistance, improves performance.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The semiconductor industry is transitioning from tungsten to molybdenum (Mo) to meet the demands of the AI era Mo’s lower resistivity and lack of barrier layer enable scalability while...

For the second year in a row Texas Instruments (TI) has awarded Lam Research its highest level of supplier recognition

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

For Lam Research, Oregon isn’t just a place to work–it’s home. For over three decades, we’ve been proud to put down roots in the Silicon Forest. How it started: It all began with a secret....

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

Driving the news: Lam recently celebrated two significant milestones at our Enschede, Netherlands, location: the grand opening of a newly remodeled facility and the third anniversary of a...

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

Lam Research has been recognized by Fortune as one of the World’s Most Admired Companies for the eighth consecutive year. Why it matters: The annual survey recognizes the world’s largest...

Each year, our employees come together through our Deliver Joy campaign to make a difference in the communities we call home. In 2024, we set new records - 2,506 employee participants, 16,451...

Lam's team conducted critical simulations and experiments that refined the plasma etching process.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Driving the news: Lam Research secures a spot on the 2024 Dow Jones Sustainability Index (DJSI) North America1 for the fourth year in a row, maintaining our position as a corporate sustainability...

Lam Research's new cobot, Dextro, can offload some of the most challenging and essential maintenance and cleaning tasks from human workers.

As a company deeply committed to fostering an inclusive and supportive workplace for all, I’m proud to share that we have earned a perfect score of 100 on the Human Rights Campaign’s (HRC)...

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.

Dextro, the industry’s first maintenance cobot, works alongside engineers to keep machines in good working order for improved overall yields.

The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.

Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.

VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.

Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.

AR and VR are helping the company shift left and ramp for the $1 trillion industry Lam’s adoption of immersive technologies is expected to beat today’s KPIs by 20% Driving the news: With the...

On Tuesday, October 8, Tim Archer, president and CEO of Lam Research, and Joon Park, regional vice president of Lam Research Korea, celebrated the grand opening of Lam’s new Yongin Campus in...

Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...