Blog

Glass substrates offer mechanical, electrical, and chemical advantages for AI and HPC chips Industrywide adoption first requires resolving manufacturing and standardization issues Lam is helping...

Lam and imec are expanding joint R&D to accelerate manufacturing readiness.

AI is increasing demand for larger and more complex chip packages. Traditional wafer-based packaging faces scaling challenges for large-format designs. Panel-level processing may improve...

Lam's labs are part of a purpose-built, globally integrated R&D infrastructure designed to accelerate innovation across technology inflections.

SABRE 3D is an electrochemical deposition solution engineered for precision copper plating (the critical wiring of modern semiconductor devices).

AI is redefining semiconductor scaling Audrey Charles discusses the technologies, partnerships, and innovations that will define the future of semiconductor scaling AI is driving unprecedented...

Panel-level packaging enables higher area efficiency and scalability for large-format advanced packages

Everything—NAND, Logic, DRAM, and packaging—is going 3D. The 3D era demands deeper etch and precise deposition to build taller, tighter devices.

Lam’s leadership in 3D NAND built the playbook for memory’s complex architectural transition. Companies that learn from and apply their experience will lead the way to 3D DRAM.

AI is compressing chip development timelines and raising the stakes for equipment suppliers Here is how Lam is responding Speed has always mattered in the semiconductor industry. What is different...

The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.

Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.

SEMulator3D® Analytics is useful in calibrating FinFET device profiles, helping engineers achieve high precision in modeling fin etch depth and critical dimensions.

DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.

Lam Research’s Aether dry resist technology eliminates pattern collapse and reduces defects, enabling precise, high‑aspect‑ratio features for next‑generation 3D DRAM and HBM.

With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.

Lam Research is setting the agenda for the wafer fabrication equipment industry's approach to a silicon photonics revolution

DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.

Lam’s newest innovation, the VECTOR® TEOS 3D tool, is crafted at its Tualatin, Oregon facility by a talented local workforce known for its multidisciplinary expertise. The company’s strong commitment to employee safety, career satisfaction, and professional growth has resulted in an outstanding retention rate, making Tualatin a standout example of manufacturing excellence.

Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.

Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

As Moore’s Law slows, advanced semiconductor packaging techniques are being adopted to integrate multiple chip types like logic, memory, and I/O into a single package, enhancing performance and cost-efficiency.

A critical step toward enabling the next wave of advanced packaging

Lam Research offers a range of advanced tools and technologies designed to support semiconductor manufacturing, focusing on precision, innovation, and improving chip production processes. These solutions include etch and deposition systems, process control tools, and software products aimed at next-generation device fabrication.

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Higher memory densities can be achieved with 3D NAND by increasing the number of metal and oxide layers. We looked at how to avoid tier bending and collapse that can accompany increasing layers using SEMulator3D.

Discover how Lam Research's ALTUS® Halo tool is transforming semiconductor manufacturing with molybdenum.

A microchip (also known as a “chip” or “integrated circuit” [IC]) is a chunk of semiconducting material embedded with billions of transistors.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Driving the news: Today, Lam Research received the Coat of Arms from Günther Albel, the Mayor of Villach, Austria, in recognition of our over 30-year presence in the city and our contributions to...

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.

Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...

Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions

System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.

SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...

Lam Research was the platinum sponsor of the 27th gathering of SEMICON Taiwan, held September 14 to 16. More than 45,000 attendees examined 2,450 exhibition booths showing the latest industry...

The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...

Every few months, new and improved electronics are introduced. They’re typically smaller, smarter, faster, have more bandwidth, are more power-efficient, etc. – all thanks to a new generation...

The 22nd Electronics Packaging Technology Conference (EPTC) is going virtual this year. The flagship event of the IEEE Electronics Packaging Society (EPS) in Region 10 will highlight technical...

SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights on...

The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via upgrades to 200 mm equipment is a cost appropriate...

Technology experts and business leaders will be heading to the Advanced Semiconductor Technology Conference (ASTC) 2019, organized by SEMI Southeast Asia. Held November 7-8, 2019 at the Marina Bay...

At an industry and investor event held during the August 2019 Flash Memory Summit, Lam management made the case for why semiconductor innovation needs to accelerate in the 5G era and how Lam is...

Electrochemistry and solid state science and technology will be featured at the 235th ECS Meeting, to be held May 26–30 in Dallas, Texas. Over the week, nearly two thousand talks will be given...

On May 7, 2019, semiconductor leaders and industry experts from around the world will convene at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia to showcase...

At this year’s SEMICON China, industry leaders from around the globe will come together for this fast-growing and dynamic microelectronics market to view products, technologies and brands that...

The Electronics Packaging Technology Conference (EPTC 2018), an international event organized by the IEEE Reliability/CPMT/ED Singapore Chapter, will be held December 4–7 at the Resorts World...

Starting on September 30, scientists, engineers, researchers, and industry professionals from around the globe will meet in Cancun, Mexico, at the Americas International Meeting on...

Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of...

Industry advancements and novel transformations in semiconductors will be addressed at SEMICON Southeast Asia 2018 from May 22-24 at the new Malaysia International Trade & Exhibition Centre...

Welcome back to the Lam Blog. We hope you had a happy and prosperous holiday season. As a prelude to what you can expect in upcoming blog stories, we wanted to highlight some of the favorite posts...

From discovering the circulatory system in 1616 to performing the first heart transplant in 1967, the world of medicine has long been one of experimentation and innovation. Today, it is also a...

For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – at Messe München in Munich,...

The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected to attract more...

From smart grids to smart buildings, the Internet of Things (IoT) has swept across Asia. Going well beyond consumer wearables, today’s city planners are leveraging IoT-enabled technologies to...

Household kitchens have been revolutionized by chips (we’re talking the non-edible kind). Some of us may bask in fond memories of “low-tech” cooking like toasting marshmallows over an open...

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important topic of discussion....

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost of back-end processes for some...

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking business. Attendees...

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, 2017. Korea is the world’s...

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure...

Thinking of a career in a science, technology, engineering, or math (STEM) field? The information we collected during interviews with four of Lam’s women engineers working in our Asia offices...

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world,...

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors from around the...

The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on a chip. As advanced devices...

Building on its inaugural success last year, this year’s SEMICON Southeast Asia 2016 takes place April 26-28 at the SPICE Arena in Penang, Malaysia. Lam is pleased to be a premier sponsor of...

Our world is full of high-tech innovations. From smartphones, computers, and entertainment products to extraordinary advances in medicine, science, and countless industries, we’ve all seen how...

We often hear the word “inflection” used in the semiconductor industry, but what does it mean? In general, inflection refers to a point of change. In mathematics, for instance, an inflection...

Dr. Rick Gottscho, executive vice president of Global Products at Lam, is among the 102 new members honored with election to the National Academy of Engineering (NAE). The rigorous nomination...

With the new year underway, you may be wondering what lies ahead for the semiconductor world. Once again, Solid State Technology has checked in with industry leaders for their thoughts on the...

To help kick-off the new year, we thought we’d share a few of our favorite stories from 2015. These blog articles celebrated milestones like the 50th anniversary of Moore’s Law and Lam’s own...