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Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...

By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.

Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).

Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...

CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding

Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.

The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches

Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.

“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.

Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.

Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.

Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.

On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.

Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.

Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.

Pulsus enables the deposition of high-quality, highly scandium-doped AlScN films

Etching is critical for creating complex structures and architectures for the AI era

The event is the only startup competition with a monetary award for semiconductor startups

Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.

This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.

The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.

Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.

Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...

Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...

Introducing Pulsus, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.

There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.

Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...

One-of-a-kind contest supports semiconductor startups with investment and exposure

On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles

On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law

We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.

Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.

The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.

Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.

Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...

Enables more efficient process development via high-fidelity plasma simulation

The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.

Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control

Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.

Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.

BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.

Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.

DRAM is following NAND in going 3D, but architecture needs are unique and challenging. 3D DRAM is needed to keep up with the demands of graphics cards, portable devices, and more. Here's an idea of how to architect it.

Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform

New portfolio joins physical and virtual semiconductor worlds into a single ecosystem

Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions

As transistor sizes shrink, short channel effects make it more difficult for transistor gates to turn a transistor ON and OFF [1]. One method to overcome this problem is to move away from planar...

As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have...

Achievement represents close collaboration with our customers and supply chain partners LMK joins Lam’s manufacturing operations in Livermore, Tualatin, and Taiwan in this milestone This week,...

EVs can have almost twice as many microchips as combustion engine vehicles. Lam is a critical supplier for semiconductor manufacturers for EVs across all technologies.

Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...

The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.

Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...

System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.

Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...

With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...

SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...

Metryx marked 200th tool shipment by donating science equipment to a local high school

Line edge roughness (LER) can occur during the exposure step in lithography [1-2]. Similarly, etch and deposition process steps can leave a roughness on semiconductor surfaces. LER is a stochastic...

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade...

“Engineering a Greener Fab” was the theme of the Lam Research Technical Symposium, Lam’s premiere forum for intellectual and scientific sharing.

Introduction The semiconductor industry has been focused on scaling and developing advanced technologies using advanced etch tools and techniques. With decreasing semiconductor device dimensions...

Lam Research was the platinum sponsor of the 27th gathering of SEMICON Taiwan, held September 14 to 16. More than 45,000 attendees examined 2,450 exhibition booths showing the latest industry...

Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce...

With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of...

John has 25 years in the industry and 49 patents to his name Multidisciplinary skills in dep and etch have led to groundbreaking work John Drewery has been named a Lam Research Fellow for...

Introduction BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line-to-line...

The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are...

And yes, we’ve got a solution for that In the recent blog article Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected, David Haynes from our Customer...

Lam Research will join fellow industry leaders from the extended electronics supply chain in a range of talks at the SEMICON West 2022 hybrid conference later this month. During the 52nd annual...

Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more...

It takes a lot of different types of process tools to make chips, from deposition, to lithographic to etch and to cleaning tools among others. Large scale production requires chipmakers to use...

Introduction As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for...

Design of Experiments (DOE) is a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and...

Over the past decade, the need for increasingly smaller, denser, more powerful chips has been driving semiconductor manufacturers to move away from planar structures in favor of increasingly...

Today, I am proud and excited to officially announce the availability of three new precision selective etch innovations from Lam Research: Argos®, Prevos™, and Selis®. Designed to complement...

When I was a small child, I remember watching a 1966 American sci-fi adventure movie called “Fantastic Voyage” (the Korean title was “Micro Squad”) on an old black-and-white TV. The...

The logic and memory chips that power our smart phones, laptops, gaming consoles and other favorite devices may be stealing all the headlines these days, but there are other types of...

For decades, the semiconductor industry has been defined by our ability to innovate. Each time we’ve been faced with seemingly insurmountable technological challenges, we have invented...

The ability to process data is foundational to our smart, connected world. Microprocessors, in turn, rely on memory chips to store the data they need while working. One of the most popular types...

Lam recently achieved an impressive product milestone with the shipment of our 10,000th single wafer clean chamber. This marks an incredible journey from the SP100 single chamber product first...

We play a critical role in driving semiconductor breakthroughs for the next generation. Since 2015, Unlock Ideas has been an integral program to unleash the power of innovation by providing gifts...

From August 23-27, our experts will join industry leaders at SEMICON Southeast Asia, to discuss semiconductor advancements in an era of 5G and next-generation technologies. Themed “Powering...

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone age, bronze age and iron age were all essential...

There’s a lot of talk about the Internet of Things (IoT) and its impact on our day-to-day lives. From home security systems to smart watches, IoT is upgrading the technologies we rely on every...

Helium gas is increasingly in short supply. While consumers may be most familiar with it for use in filling balloons, it is used much more heavily in a variety of industrial processes –...

Back in 1981, Lam pioneered single-wafer plasma etch tools with its first product, the Lam AutoEtch 480 plasma etcher. Introduced as “a streamlined plasma etching system designed specifically...

The IEEE International Interconnect Technology Conference (IITC) will be held July 6-9, 2021, as a hybrid event – virtual and in-person (Kyoto Research Park, Kyoto, Japan), with on-demand...

Preventative Maintenance “What is wet, but dry?” might sound like a riddle, and the answer for plasma process tools are “wet cleans,” an important type of preventative maintenance. The...

Chip features continue to shrink to incredibly small dimensions and different device architectures are being devised to supply consumers with more powerful electronics. Atomic layer deposition...

The pervasive use of technology has brought about a tremendous growth in data as well as an explosion in scaling and complexity of integrated circuits. That trend continues as the focus on...

We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows up in their lives. It’s not just their...

Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June 3....

Silicon chip manufacturing has always included etching as a critical processing step. But, increasingly, extremely high-aspect-ratio etching has been needed for 3D flash and DRAM chips, which have...

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer;...

Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards,...

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps that transfers chip...