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|Nov 20, 2023|Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.
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|Nov 16, 2023|Nearly all microchips begin as slices of highly purified silicon.
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|Nov 8, 2023|Colleen enlisted in the U.S. Navy at the age of 18 right after high school She applied her experience of equipping ships in the Pacific Ocean to Lam’s supply chain In recognition of Veterans...
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|Nov 8, 2023|Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...
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|Oct 25, 2023|Enables more efficient process development via high-fidelity plasma simulation
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|Oct 19, 2023|The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.
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|Oct 6, 2023|Ammar was raised in a rural village in Malaysia FIRST® Global has given him the opportunity to dream beyond his geographical roots Ammar Akhmal wants to be a computer scientist. It’s a big...
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|Sep 28, 2023|Related articles: Why Lam Research Is Investing in India Lam Unveils New Technology Center
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|Sep 26, 2023|Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control
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|Sep 18, 2023|Interns joined our sites across the globe to contribute to critical projects They took over our operations in field service, engineering, and manufacturing Every summer, I’m energized by our...
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|Sep 14, 2023|Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.
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|Aug 31, 2023|Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.
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|Aug 23, 2023|BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.
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|Aug 9, 2023|Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.
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|Aug 7, 2023|The terms “fab” and “foundry” are often used interchangeably, but that’s technically incorrect. Knowing the difference is important so you can better understand the semiconductor ecosystem.
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|Jul 18, 2023|The semiconductor industry may double in size. The environmental impact can’t increase at the same rate.
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|Jul 14, 2023|DRAM is following NAND in going 3D, but architecture needs are unique and challenging. 3D DRAM is needed to keep up with the demands of graphics cards, portable devices, and more. Here's an idea of how to architect it.
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|Jun 30, 2023|As we recognize Pride Month throughout June alongside the LGBTQ+ community, the topic of allyship comes up a lot. My allyship journey began in third grade when my principal, Mrs. Carroll,...
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|Jun 27, 2023|Close collaboration with customers leads to rapid and predictable achievement of cost goals.
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|Jun 26, 2023|This video is part of Lam’s Pride Month story collection, which amplifies the voices of employees embracing equity across the company.
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|Jun 23, 2023|Priscilla is the platform tool owner for Lam’s dielectric etch Sense.i tools She brought her childhood passion for problem-solving to our customers’ chipmaking fabs In celebration of...
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|Jun 22, 2023|Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform
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|Jun 22, 2023|New portfolio joins physical and virtual semiconductor worlds into a single ecosystem
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|Jun 20, 2023|Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions
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|Jun 14, 2023|As transistor sizes shrink, short channel effects make it more difficult for transistor gates to turn a transistor ON and OFF [1]. One method to overcome this problem is to move away from planar...
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|Jun 13, 2023|For the seventh year in a row, Lam was ranked on the Fortune 500, coming in at #240 with more than $17.2 billion in revenue. Since first debuting on the Fortune 500 at #491 in 2016, Lam has jumped...
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|Jun 7, 2023|From the earliest chips to the latest technologies, silicon has long played a major role in semiconductor manufacturing as the substrates (wafers) on which devices are built.
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|May 30, 2023|As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have...
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|May 25, 2023|Achievement represents close collaboration with our customers and supply chain partners LMK joins Lam’s manufacturing operations in Livermore, Tualatin, and Taiwan in this milestone This week,...
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|May 10, 2023|Lam Research has won a prestigious Edison Award for best new products in materials science. The bronze medal was awarded for our recently launched innovative suite of selective etch products...
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|May 2, 2023|EVs can have almost twice as many microchips as combustion engine vehicles. Lam is a critical supplier for semiconductor manufacturers for EVs across all technologies.
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|Apr 13, 2023|Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...
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|Apr 12, 2023|The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.
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|Apr 5, 2023|Hong Shih is one of 10 employees within the company who has been elevated to Lam Fellow He has more than 40 years of experience in sciences and engineering with over 30 years working in the...
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|Mar 22, 2023|Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...
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|Mar 17, 2023|System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.
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|Mar 7, 2023|Women in Leadership at Lam has over 200 members Lam India has increased its diversity hiring percentages In recognition of International Women’s Day, Tina Correia, chief accounting officer, head...
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|Mar 7, 2023|Gosia’s redirection in her studies resulted in a 20+ year long career in semiconductors A little bit of luck and a whole lot of talent got her to where she is today I sat down with Gosia...
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|Mar 3, 2023|Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...
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|Feb 28, 2023|With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...
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|Feb 16, 2023|SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...
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|Feb 10, 2023|Lam’s BEN ERG has grown by four times over a two-year period Our I&D actions and behaviors impact the communities where we live and work In recognition of Black History Month, Sherry Buie,...
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|Feb 2, 2023|Metryx marked 200th tool shipment by donating science equipment to a local high school
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|Jan 20, 2023|Nearly 2,000 employees participated in Deliver Joy programs, supporting 1,300 organizations More 10,640 volunteer hours were logged by our employees Deliver Joy in November and December is a...
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|Jan 18, 2023|Sunday, January 22, marks the start of Lunar New Year. Across the world, including much of East Asia, nearly 1.5 billion people will ring in the Year of the Rabbit. According to the Chinese...
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|Jan 13, 2023|Line edge roughness (LER) can occur during the exposure step in lithography [1-2]. Similarly, etch and deposition process steps can leave a roughness on semiconductor surfaces. LER is a stochastic...
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|Dec 19, 2022|At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade...
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|Dec 13, 2022|Lam Japan has grown from nearly ten employees to over 500 in 30 years The company donated nearly $9,000 to local NGOs as part of the celebration Lam celebrated 30 years of operations in Japan on...
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|Dec 12, 2022|Lam is once again named to the Dow Jones Sustainability Index for North America The company joins the UN Global Compact It’s been a year of progress as we march toward our goal to achieve net...
