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As AI accelerates demand for advanced chips, sustainability is becoming essential for long-term growth

Digital twin technology combined with machine learning enables a dramatic yield improvement from 1.6% to 87.2% in GAA logic manufacturing by simulating and optimizing the entire fabrication process.

The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone for semiconductor manufacturing.

Equipment Intelligence® encompasses Lam’s technology portfolio both on and off tool to leverage sensors, data, algorithms, artificial intelligence, and robotics automation to make tools more autonomous and productive.

As semiconductor manufacturing grows more complex, sensor‑driven intelligence is emerging as a critical enabler of autonomous, data‑driven fabs.

Lam Research won two prestigious 2026 Edison Awards, for ALTUS® Halo and Akara®

Pattern-dependent etch can lead to variations across the same chip. Dummy fill and SEMulator3D® help reduce shallow trench isolation and recess nonuniformity.

Everything—NAND, Logic, DRAM, and packaging—is going 3D. The 3D era demands deeper etch and precise deposition to build taller, tighter devices.

In this edition of Semi 101, we explore the evolution of transistor architectures that have enabled logic scaling.

In DRAM SAQP, small process variations can compound into pitch walk and, with LER, create line-bridge defects. Monte Carlo virtual fabrication reveals these interactions to tighten process windows and reduce wafer experimentation.

AI is compressing chip development timelines and raising the stakes for equipment suppliers Here is how Lam is responding Speed has always mattered in the semiconductor industry. What is different...

IBM and Lam Research have partnered in a five-year collaboration to develop processes that enable logic chip scaling beyond the 1nm node using high-NA EUV lithography.

The 2026 Lam Capital Venture Competition is a unique event that connects semiconductor startups with industry leaders, investors, and technical experts to advance AI-enabled semiconductor technologies.

SEMulator3D® Analytics is useful in calibrating FinFET device profiles, helping engineers achieve high precision in modeling fin etch depth and critical dimensions.

With AI's overwhelming demand for DRAM, Lam is accelerating its response with streamlined workflows and specialized tools help speed efficiency, yield, and cost savings.

Boise investment keeps Lam’s capabilities tightly coupled to customer roadmaps

DRAM scaling has reached the angstrom level—and the advanced architectures and processes that make higher performance and lower cost per bit possible. Watch now to see how memory keeps getting smaller.

Lam Research and CEA-Leti have formed a multi-year partnership to accelerate the development of specialty technology devices critical for AI hardware. This collaboration focuses on advancing materials, processes, and manufacturable solutions to improve energy efficiency and performance in AI data centers.

With over 40 years in making semiconductor equipment, Lam Research has demonstrated leadership in etch and deposition that meet the precision and yield demands of advanced packaging, helping customers ramp new technologies with confidence.

Not every chip on a wafer behaves the same; even small variations can impact yield. The Lam Semiverse Solutions team explains how engineers use virtual fabrication to understand why these differences happen and how to fix them.

Lam’s Aether® dry‑resist technology plays a key role in enabling next-gen logic chips, including the latest 2 nm node

DRAM is volatile memory that has the advantages of simplicity and high density. Lam is continuously innovating for each DRAM inflection as data-intensive AI requires more and more data at higher speeds.

Manufacturing breakthroughs in advanced chip packaging—especially heterogeneous integration and 3D stacking—are critical to powering the future of AI.

Watch the video on the next wave of semiconductor innovation with advanced packaging solutions from Lam Research.

Self-aligned backside contact (SABC) architectures in advanced GAA transistors expand the process window, reducing defects and improving chip yield.

Molybdenum hybrid metallization is driving innovation in semiconductor materials for AI, 5G, and data centers. These advances boost performance, sustainability, and efficiency in chip manufacturing.

The article discusses the challenges and solutions for back-end-of-line (BEOL) patterning at the 3-nm semiconductor node, focusing on controlling critical process parameters to manage edge placement error (EPE) and critical dimension (CD) variability.

Students at a growing number of U.S. schools learn the “why” of advanced 3D processes SEMulator3D® helps students with immersive training on leading edge technologies.

At Lam we're pairing human ingenuity with advanced mechatronics and automation to solve big challenges for our customers. That same spirit will be on display at the 2025 FIRST Global Challenge.

Lam CVP David Fried explains how Fabtex Yield Optimizer is the newest Semiverse Solutions technology to help the semiconductor industry achieve higher yields

The Colorado School of Mines award is given to its most generous contributors Research investigates ways to improve etch selectivity, thermal ALD, and more Share this news with your network

Lam Research earned the 2025 SEMI Award for North America for our pioneering cryogenic etch technology

Fabtex™ Yield Optimizer is a new Semiverse® Solutions product designed to improve yield and reduce process variability in high-volume semiconductor manufacturing.

Virtual twins and process modeling speed up semiconductor development by simulating and optimizing designs before fabrication. This case study shows how to address etch uniformity issues from etch loading in slit patterns, enabling faster, more precise process optimization.

Lam Research offers a range of advanced tools and technologies designed to support semiconductor manufacturing, focusing on precision, innovation, and improving chip production processes. These solutions include etch and deposition systems, process control tools, and software products aimed at next-generation device fabrication.

Advanced packaging is a critical technology driving the performance, efficiency, and form factor improvements of AI chips, enabling the ongoing AI revolution.

HBM's 3D stacked architecture delivers 16x higher bandwidth than traditional memory. Lam Research leads the industry in HBM manufacturing equipment

TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging. Its proprietary clamping technology handles challenging high-bow wafers.

Advanced packaging makes it possible to manufacture higher performing, next-gen chips. Read about what makes advanced packaging different from traditional chip packaging methods today.

Lam Research is addressing critical challenges in the U.S. semiconductor industry by partnering with universities to enhance semiconductor engineering education through Semiverse® Solutions.

Explore what a semiconductor node really means in today’s chipmaking world. Learn how node sizes have evolved and why they matter for performance, efficiency, and innovation.

Advanced patterning techniques are essential for manufacturing next-generation semiconductor chips with extremely small and precise features, enabling higher performance, greater functionality, and improved cost efficiency in logic, DRAM, and NAND devices.

Gowri explains the challenges faced by chipmakers as they turn to 3D structures for logic, memory, and storage to continue Moore’s Law.

Ion Beam Etch (IBE) is a promising technology for extreme ultraviolet (EUV) lithography by significantly improving line edge roughness (LER) and line width roughness (LWR).

Lam Research has been honored with the prestigious 2025 Edison Gold Award for Innovation in Production Processes, recognizing its Cryo™ 3.0 cryogenic etch technology.

Lam's Semiverse Solutions team explores the innovative approach of backside power delivery networks (BSPDNs) in semiconductor technology.

The Semi 101 series is a beginner’s guide to understanding microchips and the semiconductor industry – from components to processes and everything in between. This guide is updated regularly.

Lam engineers worked with a customer to develop a short-term solution that has the potential to reduce the use of high GWP gases like NF3 that is also relatively easy to implement and doesn’t jeopardize the quality of the production.

DWMG structures can help improve DRAM by reducing energy waste. These structures fix a known flaw called “gate-induced drain leakage” (GIDL).

Lam’s latest etch tool, called Akara®, is a significant achievement that helps enable the future of semiconductors requiring small, complex structures. Akara uses proprietary plasma processing technologies to deliver a high degree of etch process control and responsiveness that goes beyond the capabilities of mainstream plasma etch technologies.

Lam has developed the world's only EUV dry resist deposition and dry development technologies with capabilities that support leading-edge pattern fidelity, defectivity, material usage, and overall cost of ownership.

To evaluate stress and mitigate its effects, predictive 3D process models can be used to predict the impact of mechanical stress on yield and performance.

Virtual twin technologies can reduce the carbon footprint of the tool R&D process.

Lam’s university collaborations supports Lam’s technology pipeline and talent pipeline with creative approaches to industry challenges.

AR and VR are helping the company shift left and ramp for the $1 trillion industry Lam’s adoption of immersive technologies is expected to beat today’s KPIs by 20% Driving the news: With the...

Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...

Nearly all microchips begin as slices of highly purified silicon.

The terms “fab” and “foundry” are often used interchangeably, but that’s technically incorrect. Knowing the difference is important so you can better understand the semiconductor ecosystem.

From the earliest chips to the latest technologies, silicon has long played a major role in semiconductor manufacturing as the substrates (wafers) on which devices are built.

Lam Research has won a prestigious Edison Award for best new products in materials science. The bronze medal was awarded for our recently launched innovative suite of selective etch products...

Hong Shih is one of 10 employees within the company who has been elevated to Lam Fellow He has more than 40 years of experience in sciences and engineering with over 30 years working in the...

Gosia’s redirection in her studies resulted in a 20+ year long career in semiconductors A little bit of luck and a whole lot of talent got her to where she is today I sat down with Gosia...

SEMICON Korea 2023 kicked off with a keynote speech, “Accelerating Innovation – From Lab to Fab,” delivered by Pat Lord, EVP of the Customer Support Business Group and Global Operations. Pat...

Lam Research was the platinum sponsor of the 27th gathering of SEMICON Taiwan, held September 14 to 16. More than 45,000 attendees examined 2,450 exhibition booths showing the latest industry...

Calling all innovative entrepreneurs working on sustainability solutions The winner will be offered a $250,000 SAFE investment Theme is “Engineering a Greener Fab” Heatwaves such as the one...

The electronics supply chain recently gathered together at SEMICON Southeast Asia, a premier event that promotes growth of the semiconductor and microelectronics ecosystem in the region. Held June...

And yes, we’ve got a solution for that In the recent blog article Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected, David Haynes from our Customer...

Lam Research will join fellow industry leaders from the extended electronics supply chain in a range of talks at the SEMICON West 2022 hybrid conference later this month. During the 52nd annual...

Every few months, new and improved electronics are introduced. They’re typically smaller, smarter, faster, have more bandwidth, are more power-efficient, etc. – all thanks to a new generation...

It takes a lot of different types of process tools to make chips, from deposition, to lithographic to etch and to cleaning tools among others. Large scale production requires chipmakers to use...

David Haynes, vice president of Specialty Technologies for the Customer Support Business Group (CSBG) at Lam Research, discusses the introduction of Wi-Fi 6 and how, together with 5G, it will...

Once considered to be science fiction and fodder for Hollywood films, artificial intelligence (AI) has become a near-ubiquitous technology in our communities, homes and workplaces that is helping...

The ability to process data is foundational to our smart, connected world. Microprocessors, in turn, rely on memory chips to store the data they need while working. One of the most popular types...

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone age, bronze age and iron age were all essential...

There’s a lot of talk about the Internet of Things (IoT) and its impact on our day-to-day lives. From home security systems to smart watches, IoT is upgrading the technologies we rely on every...

We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows up in their lives. It’s not just their...

The excitement around the rollout of 5G technology could not be more palpable. We see this next-generation technology in news headlines and commercials, with promises to usher in the next wave of...

To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that help put technology concepts into perspective...

The 22nd Electronics Packaging Technology Conference (EPTC) is going virtual this year. The flagship event of the IEEE Electronics Packaging Society (EPS) in Region 10 will highlight technical...

The movement of money has undergone substantial changes over the years. With the advent of financial technology, or FinTech, the financial services industry has transformed. Enabled by today’s...

Semiconductors can be considered as one of the most important inventions of all time. They are foundational to our ability to connect with each other; to collect, store and process information;...

Cities around the globe are experiencing software updates – swapping out antiquated data collection techniques for new technological initiatives to promote efficiency, transparency, and...

CMOS Image Sensor (CIS) technology has changed the way we interact with our devices and is expected to see significant growth in the market in the coming years. David Haynes, managing director of...

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes,...

The medical space is constantly improving – experimenting and innovating to arrive at the most cutting-edge procedures. The past few decades have seen unprecedented advancements in medicine due...

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes in manufacturing being...

n 2019, 98.2 million viewers tuned in to watch the Superbowl, hailing the event as the “most viewed broadcast in America.” In recent years, a new player has emerged – eSports – bringing in...

Have you ever seen a lightning bolt? What about the northern lights or a neon sign? These things are made of plasma, the fourth state of matter that makes up nearly 99.9% of the universe. In the...

It’s pretty hard to talk about technology today without artificial intelligence, or AI, entering into the conversation. It seems to be everywhere… and growing. Businesses are using it to...

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor...

Augmented reality (AR) and virtual reality (VR) have unlocked incredible possibilities in education – bringing tomorrow’s technology into today’s learning. The influence of AR and VR...

2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to Work Day, to showcasing our innovative technology and productivity...

The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via upgrades to 200 mm equipment is a cost appropriate...

For those of us in the semiconductor industry, the periodic table is more than just a poster on a science classroom wall: it’s a valuable resource that we use to create new logic and memory...

Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. Yang Pan, corporate vice president of advanced technology development, shares...

You don’t have to look very far in the semiconductor world before you see the word “scaling.” Perhaps you read an industry news article headline about transistor scaling – how those nearly...

At an industry and investor event held during the August 2019 Flash Memory Summit, Lam management made the case for why semiconductor innovation needs to accelerate in the 5G era and how Lam is...

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the...

Every industry has its unique lingo and the semiconductor industry is no different. Here, chips mean something a little different from our favorite snack and the word “fab” isn’t just used...

More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the...