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- |Nov 20, 2024|
The latest advancements in semiconductor interconnect technologies, focusing on optimizing metal pitch structures for sub-2nm nodes.
- |Oct 30, 2024|
Process engineers can generate a uniform, targeted etch result using predictable etch mechanisms and behavior.
- |Oct 29, 2024|
VizGlow® 3.1, Lam’s latest release of its plasma-modeling software, brings significant advances in plasma simulations.
- |Oct 24, 2024|
Intelligent machines enable faster design, production, maintenance, and process improvements. Numerous benefits can be gained from self-aware, self-maintained, and adaptive tools.
- |Oct 22, 2024|
AR and VR are helping the company shift left and ramp for the $1 trillion industry Lam’s adoption of immersive technologies is expected to beat today’s KPIs by 20% Driving the news: With the...
- |Oct 14, 2024|
On Tuesday, October 8, Tim Archer, president and CEO of Lam Research, and Joon Park, regional vice president of Lam Research Korea, celebrated the grand opening of Lam’s new Yongin Campus in...
- |Oct 8, 2024|
Deposition is when a thin layer of material is added to the surface of a wafer Each deposition process varies depending on the material and the purpose it serves on a chip The Semi 101 series is a...
- |Sep 30, 2024|
In 2023, Lam Research began a three-year, $10 million investment in FIRST® Global, an organization that inspires leadership and innovation in youth worldwide by empowering them through STEM. Take...
- |Sep 23, 2024|
Lam honors nine suppliers with 2024 Excellence Awards The awards highlight Lam’s commitment to building a responsible and ethical supply chain Driving the news: Today, we announced this year’s...
- |Sep 18, 2024|
By leveraging compact and neural network models, we predict capacitance performance with unprecedented accuracy.
- |Sep 12, 2024|
Lam Research offers a broad array of industry-leading tools and solutions designed to scale high-bandwidth memory (HBM).
- |Sep 10, 2024|
On Monday, September 9, we announced the development of a systems lab at our India Center for Engineering in Bengaluru. This new facility will be one of the most advanced semiconductor labs in the...
- |Sep 6, 2024|
Lam pledged $10 million to FIRST® Global, a nonprofit inspiring future STEM leaders Our university programs help students explore what’s possible in their careers Alexandre Toscano has a...
- |Sep 4, 2024|
Sometimes the technology behind the scenes is just as impressive as the one that gets all the attention. So, it is with Generative AI. While most everyone seems to be falling over themselves...
- |Aug 28, 2024|
CheePing Lee explains how Lam Research is at the forefront of pioneering solutions like high-bandwidth memory (HBM) and hybrid bonding
- |Aug 27, 2024|
Digital twins help increase precision, affordability, sustainability, and speed-to-solution. Semiverse Solutions helps find the best process flow or recipe out of infinite combinations.
- |Aug 21, 2024|
The field of TCAD, once a humble tool in the vast landscape of semiconductor technology, has unveiled its invaluable riches
- |Aug 20, 2024|
Lam’s Equipment Intelligence® was recognized as the 2024 Innovative Product of the Year in the AI/Machine Learning category at the Sensors Awards
- |Aug 15, 2024|
Learn about three key semiconductor markets and Lam’s role in supporting our customers Find out what innovative technology is driving each market and Lam’s tools that help enable it Lam...
- |Aug 14, 2024|
To harness full potential of AI, we must contend with several grand challenges to enable 1,000-layer scaling.
- |Aug 8, 2024|
“Scaling to 1000-Layer 3D NAND in the AI Era" is a pivotal white paper written by Counterpoint Research and sponsored by Lam Research.
- |Aug 7, 2024|
Discover how Lam Research is achieving unprecedented storage capacities and speeds with their 1,000-layer 3D NAND chips.
- |Aug 1, 2024|
Driving the news: Today, Lam Research received the Coat of Arms from Günther Albel, the Mayor of Villach, Austria, in recognition of our over 30-year presence in the city and our contributions to...
- |Jul 31, 2024|
Lam Cryo™ 3.0 builds on 20 years of pioneering memory etch technology and five years of production proven cryogenic etch technologies. The tool overcomes manufacturing challenges in scaling 3D NAND vertically, laterally, and logically.
- |Jul 23, 2024|
Lam Research has been an etch leader for decades, including by pioneering technology in cryo etch.
- |Jul 16, 2024|
On how to reduce transistor capacitance at the 5nm node using a source/drain contact recess.
- |Jun 27, 2024|
Lam Research published our latest Environmental, Social, and Governance report The report focuses on energy savings across our operations, products, and supply chain This story is part of our 2023...
- |Jun 24, 2024|
Explore the critical role of semiconductor innovation in the AI revolution with our in-depth white paper, highlighting the transformative effects of AI and the future of chiplet-based solutions.
- |Jun 21, 2024|
Explore key factors that drive grand discoveries at Lam, as revealed by a top innovator Samantha Tan's visionary approach balances high-risk research with profitable outcomes Samantha Tan, Lam...
- |Jun 20, 2024|
Abstract As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance.
- |Jun 18, 2024|
Pulsus enables the deposition of high-quality, highly scandium-doped AlScN films
- |Jun 12, 2024|
Etching is critical for creating complex structures and architectures for the AI era
- |Jun 10, 2024|
Lam is a founding sponsor of Semiconductor PRIDE, a group dedicated to advancing LGBTQ+ equity By joining, Lam reaffirms our long-standing commitment to inclusion and diversity This Pride Month, we’
- |Jun 7, 2024|
The event is the only startup competition with a monetary award for semiconductor startups
- |Jun 6, 2024|
Her expertise in physical chemistry, process engineering, and business strategy help shape our industry. A new appointment on a prestigious committee extends Lam’s influence.
- |May 28, 2024|
This study demonstrates how deposition-etch cycling can reduce LER and improve device performance.
- |May 23, 2024|
Lam Research went public on the Nasdaq under the ticker symbol LRCX in 1984.
- |May 20, 2024|
The requirements of the AI era demand integrated core chips, driving vertical integration. Chip makers are just now beginning limited production of 3D packaging.
- |May 14, 2024|
As semiconductor complexity increases with scaling, specialized expertise in areas like plasma physics and artificial intelligence (AI) becomes crucial. Lam faces challenges in workforce...
- |May 9, 2024|
Lam’s newest warehouse is the most automated within the company, enabling seamless movement of materials It’s co-located with a Lam manufacturing site, reducing transportation time, cost, and...
- |Apr 23, 2024|
Lam plays a significant role in plasma science by collaborating with researchers, supporting the Allis Prize, and employing physics, chemistry, and engineering students and experts.
- |Apr 22, 2024|
A key component of Lam’s strategy is improving the energy efficiency of our products
- |Apr 16, 2024|
Abstract In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production...
- |Apr 12, 2024|
Li Fei Sun won for her paper on smart tools and ML solutions in semiconductor manufacturing In the past four years, Lam engineers have won the top award three times At Lam Research, we take pride...
- |Mar 26, 2024|
Introducing Pulsus, Lam's cutting-edge pulsed laser deposition tool. PLD enables specialty technologies like RF filters and MEMS microphones.
- |Mar 21, 2024|
There are still many challenges to be overcome before CFET designs become mainstream, but this new 3D architecture represents a promising new direction for the future of computing.
- |Mar 19, 2024|
Interest in artificial intelligence is driving data storage expansion for memory makers. Advancements in semiconductor manufacturing etch and deposition, and advanced packaging are playing a...
- |Mar 11, 2024|
One-of-a-kind contest supports semiconductor startups with investment and exposure
- |Mar 4, 2024|
Driving the news: Lam was named one of the World’s Most Ethical Companies® by Ethisphere–for the second year in a row. Lam is the only wafer fabrication equipment provider on this year’s...
- |Mar 1, 2024|
Dee’s career journey took on unexpected roles in engineering, quality, and operations She oversees the manufacturing operations across two facilities at Silfex I didn’t plan to work in...
- |Feb 28, 2024|
Explore more stories in the 'I Am Lam' video series: How Quinton McNeil Found Meaningful Work and a Community Houda Hadiji’s Resilient Career Path
- |Feb 22, 2024|
On the use and benefits of virtual fabrication in the development of DRAM saddle fin profiles
- |Feb 6, 2024|
JUST Capital and CNBC named Lam to the top 50 of its annual JUST 100 list.
- |Feb 5, 2024|
Lam Research has once again been named as one of Fortune’s World’s Most Admired Companies. This year, Lam ranked fourth on the global semiconductor industry rankings and #183 overall. 2024...
- |Feb 1, 2024|
On the use of molybdenum as a promising candidate to replace tungsten in the semiconductor industry to keep pace with Moore's Law
- |Jan 23, 2024|
We explore the causes and implications of asymmetric wafer defects in semiconductor manufacturing. We also consider the use of virtual process modeling to understand and mitigate these structural failures.
- |Jan 18, 2024|
Semiconductor manufacturers scale new heights as they embrace vertical integration. Lam’s Metior succeeds where optical measuring falls short.
- |Dec 12, 2023|
The potential of Resistive Random Access Memory (ReRAM) as an alternative to SRAM for on-chip memory in advanced CPU applications.
- |Dec 5, 2023|
In a year when the semiconductor ecosystem was in the spotlight, Lam etched a mark on the industry landscape. From groundbreaking advancements in semiconductor manufacturing to progress in...
- |Nov 20, 2023|
Virtual process development tools can accelerate the identification of process hotspots. These techniques lead to cost savings and improved yields in chip manufacturing.
- |Nov 16, 2023|
Nearly all microchips begin as slices of highly purified silicon.
- |Nov 8, 2023|
Colleen enlisted in the U.S. Navy at the age of 18 right after high school She applied her experience of equipping ships in the Pacific Ocean to Lam’s supply chain In recognition of Veterans...
- |Nov 8, 2023|
Summary: The rise of Artificial Intelligence (AI) has placed significant demands on semiconductor performance, particularly in the realm of etching technology. AI requires massive amounts of data...
- |Oct 25, 2023|
Enables more efficient process development via high-fidelity plasma simulation
- |Oct 19, 2023|
The semiconductor industry is searching for alternative metal line materials to replace copper due to the increasing barrier size and resistivity issues. Ruthenium (Ru) has shown promise as a potential replacement, outperforming copper and cobalt (Co) at smaller dimensions.
- |Oct 6, 2023|
Ammar was raised in a rural village in Malaysia FIRST® Global has given him the opportunity to dream beyond his geographical roots Ammar Akhmal wants to be a computer scientist. It’s a big...
- |Sep 28, 2023|
Related articles: Why Lam Research Is Investing in India Lam Unveils New Technology Center
- |Sep 26, 2023|
Virtual fabrication is a powerful tool to perform sensitivity analysis and provide guidance for inline process spec control
- |Sep 18, 2023|
Interns joined our sites across the globe to contribute to critical projects They took over our operations in field service, engineering, and manufacturing Every summer, I’m energized by our...
- |Sep 14, 2023|
Lam Research has supported the National GEM Consortium and GEM interns since 2019. Students who complete their fellowship have a chance to join Lam full-time.
- |Aug 31, 2023|
Video games and virtual and augmented reality are driving demand for haptics. Lam’s pulsed laser deposition capability can enable next-gen haptics technology.
- |Aug 23, 2023|
BEOL module processing faces challenges as chipmakers move to the 3 nm node and beyond. A semi-damascene integration scheme with airgap structures may help reduce RC delay time.
- |Aug 9, 2023|
Lam Research and the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) partner to train up to 60,000 semiconductor engineers.
- |Aug 7, 2023|
The terms “fab” and “foundry” are often used interchangeably, but that’s technically incorrect. Knowing the difference is important so you can better understand the semiconductor ecosystem.
- |Jul 18, 2023|
The semiconductor industry may double in size. The environmental impact can’t increase at the same rate.
- |Jul 14, 2023|
DRAM is following NAND in going 3D, but architecture needs are unique and challenging. 3D DRAM is needed to keep up with the demands of graphics cards, portable devices, and more. Here's an idea of how to architect it.
- |Jun 30, 2023|
As we recognize Pride Month throughout June alongside the LGBTQ+ community, the topic of allyship comes up a lot. My allyship journey began in third grade when my principal, Mrs. Carroll,...
- |Jun 27, 2023|
Close collaboration with customers leads to rapid and predictable achievement of cost goals.
- |Jun 26, 2023|
This video is part of Lam’s Pride Month story collection, which amplifies the voices of employees embracing equity across the company.
- |Jun 23, 2023|
Priscilla is the platform tool owner for Lam’s dielectric etch Sense.i tools She brought her childhood passion for problem-solving to our customers’ chipmaking fabs In celebration of...
- |Jun 22, 2023|
Up to 60,000 engineers in India to be trained on Lam’s unique virtual fabrication platform
- |Jun 22, 2023|
New portfolio joins physical and virtual semiconductor worlds into a single ecosystem
- |Jun 20, 2023|
Addresses key manufacturing challenges and significantly improves wafer yield Builds on Lam's 15-year heritage of innovation in bevel solutions
- |Jun 14, 2023|
As transistor sizes shrink, short channel effects make it more difficult for transistor gates to turn a transistor ON and OFF [1]. One method to overcome this problem is to move away from planar...
- |Jun 13, 2023|
For the seventh year in a row, Lam was ranked on the Fortune 500, coming in at #240 with more than $17.2 billion in revenue. Since first debuting on the Fortune 500 at #491 in 2016, Lam has jumped...
- |Jun 7, 2023|
From the earliest chips to the latest technologies, silicon has long played a major role in semiconductor manufacturing as the substrates (wafers) on which devices are built.
- |May 30, 2023|
As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have...
- |May 25, 2023|
Achievement represents close collaboration with our customers and supply chain partners LMK joins Lam’s manufacturing operations in Livermore, Tualatin, and Taiwan in this milestone This week,...
- |May 10, 2023|
Lam Research has won a prestigious Edison Award for best new products in materials science. The bronze medal was awarded for our recently launched innovative suite of selective etch products...
- |May 2, 2023|
EVs can have almost twice as many microchips as combustion engine vehicles. Lam is a critical supplier for semiconductor manufacturers for EVs across all technologies.
- |Apr 13, 2023|
Introduction In logic devices such as FinFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic...
- |Apr 12, 2023|
The journal Nature publishes Lam’s groundbreaking study. Rick Gottscho and Keren Kanarik share what it means for Lam and the semiconductor industry.
- |Apr 5, 2023|
Hong Shih is one of 10 employees within the company who has been elevated to Lam Fellow He has more than 40 years of experience in sciences and engineering with over 30 years working in the...
- |Mar 22, 2023|
Introduction Cu’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of...
- |Mar 17, 2023|
System in Package (SiP) requirements push substrate designs to smaller features (similar to FO-PLP). Convergence in requirements allows shared R&D costs for panel level processing systems.
- |Mar 7, 2023|
Women in Leadership at Lam has over 200 members Lam India has increased its diversity hiring percentages In recognition of International Women’s Day, Tina Correia, chief accounting officer, head...
- |Mar 7, 2023|
Gosia’s redirection in her studies resulted in a 20+ year long career in semiconductors A little bit of luck and a whole lot of talent got her to where she is today I sat down with Gosia...
- |Mar 3, 2023|
Soumya has automated Lam’s product software testing and processes for 19 years. The software she works on allows us to validate the behavior of our tool's software at any fab remotely. Soumya...
- |Feb 28, 2023|
With decreasing dynamic random-access memory (DRAM) cell sizes, DRAM process development has become increasingly difficult. Bit-line (BL) sensing margins and refresh times have become problematic...